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 Wafer Inspection |
 Home > Products > Wafer Inspection |
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 WIS-1000 |
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| Inspected item |
FlipChip/RDL/WLP/CIS |
| Inspection function |
Surface defect inspection (2D)
Bump inspection (3D) |
| Camera |
Line Scan CCD Camera |
| Illumination |
Hybrid type (Bright Field, Dark Field) |
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Resolution |
Throughput |
Throughput
(300mm wafer) |
9.0㎛(0.8X) |
75 WPH |
| 5.0㎛(1.4X) |
57 WPH |
| 4.0㎛(1.75X) |
50 WPH |
| 3.0㎛(2.3X) |
40 WPH |
| 2.5㎛(2.8X) |
30 WPH |
Inspection
Algorithm |
Golden Die
Advanced D2D |
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