IC Package substrate Home > 製品のご紹介 > IC Package substrate AVIS-1800plus BOC/CSP/UTC/SiP AFVI/FC CSP ICパッケージ基質用自動ビジョン検査システム 一般特長 Item 特長 Vision system Camera: 8K linescan CCD camera (TDI type: Time Delay Interface 方式) Resolution: 2 / 2.5 / 5.6 μm/pixel (解像度の交換時 Lens / 鏡筒手動交換方式) Minimum defect size: 6 / 7.5 / 16.8 μm Inspected products Type: BOC, CSP, UTC, SiP, PBGA, MMC, FC-CSP (Non-SOP) FC CSP (SOP) : 間紙使用 Size: (W)30~120mm, (L)150~270mm, (T)0.06mm and above Surface finish: Soft Au, ENIG, OSP(=Flux), Hard Gold Productivity (断面検査、Open scan時、生産性変動) Pad 検査時 Tact time (2 / 2.5 / 5.6 µm) :    45 mm : 15 / 13 / 7 sec    60 mm : 19 / 13 / 9 sec    90 mm : 25 / 19 / 9 sec Pad + PSR 検査時 Tact time (2/ 2.5 / 5.6 µm) :    45 mm : 25 / 21 / 9 sec    60 mm : 31 / 21 / 13 sec    90 mm : 44 / 35 / 13 sec (最終目標 30 / 12sec目標) Size (W)1850 x (D)1655 x (H)1760mm, Weight: 2.2ton Power AC 220v, single phase, Consumption: 4kw/h Control PC based motion control Air 4~6kg/cm2, consumption: 1200liter/min. 主要機能 Item Specification Remarks Scan width FOV 16mm @ 2.0 um resolution FOV 20mm @ 2.5 um resolution FOV 45mm @ 5.6um resolution Double scan function Particle control Dust Clean Roller 静電気を利用したクリーンローラー異物除去方式適用 Light control Automatic illumination calibration function Auto focus Auto focus function Teach procedure Less than 90minutes for Metal inspection Less than 120minutes for Metal + SR inspection Off-line Server Off-line server minimize machine down-time Multiple AFVI can share one teach file SPC SPC function is available