 Flip chip application |  Home > 製品のご紹介 > Flip chip application |
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AVIS-9000T AFVI for FC-CSP Automatic Vision Inspection System for Flip chip application  |
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| * Metal + Bump + SR Inspection * Highest Inspection Throughput 2.0~3.4sec./pc * Highest Camera Working Resolution 5.5um/pixel * Minimum Defect Size down to 15um defect |
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| Brief of AVIS-9000T |
| - JEDEC tray handling system - High Efficiency Cleaning Module (Ion-blower) - Cylindrical Dome Lighting |
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